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电子电路大全(PDF格式)-第84部分
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3。4 868MHz ASK/FSK 无线收发器芯片TDA 5250 的原理与应用电路设计································ （194）
3。4。1 概述······························································································································· （194）
3。4。2 主要技术指标················································································································ （194）
3。4。3 芯片封装与引脚功能···································································································· （195）
3。4。4 内部结构与工作原理···································································································· （197）
3。4。5 应用电路设计················································································································ （200 ）
3。5 433/870/915MH FSK 收发器芯片XE1202 的原理与应用电路设计······································· （204 ）
3。5。1 概述······························································································································· （204 ）
3。5。2 主要技术指标················································································································ （205 ）
3。5。3 芯片封装与引脚功能···································································································· （205 ）
3。5。4 内部结构与工作原理···································································································· （207 ）
3。5。5 应用电路设计················································································································ （212 ）
3。5。6 与微控制器的接口········································································································ （216 ）
3。6 433MHz FSK 收发器芯片 nRF0433 的原理与应用电路设计·················································· （219 ）
·IV ·
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3。6。1 概述······························································································································· （219 ）
3。6。2 主要性能指标················································································································ （219 ）
3。6。3 芯片封装与引脚功能···································································································· （220 ）
3。6。4 内部结构与工作原理···································································································· （220 ）
3。6。5 应用电路设计················································································································ （222 ）
3。7 433/868/915MHz FSK/ASK/OOK 收发器芯片RF2945 的原理与应用电路设计····················· （225 ）
3。7。1 概述······························································································································· （225 ）
3。7。2 主要技术指标················································································································ （225 ）
3。7。3 芯片封装与引脚功能···································································································· （226 ）
3。7。4 内部结构与工作原理···································································································· （229 ）
3。7。5 应用电路设计················································································································ （229 ）
3。7。6 电路设计实例················································································································ （232 ）
3。8 315 / 433 / 868/ 915 MHz FSK 内嵌8051 微控制器的收发器芯片CC1010 的原理与应用电路设计····· （235 ）
3。8。1 概述······························································································································· （235 ）
3。8。2 主要性能指标················································································································ （235 ）
3。8。3 芯片封装及引脚功能···································································································· （236 ）
3。8。4 内部结构与工作原理···································································································· （238 ）
3。8。5 应用电路设计················································································································ （239 ）
3。9 315。00 MHz OOK 收发器模块DR3101 的原理与应用电路设计············································· （245 ）
3。9。1 概述······························································································································· （245 ）
3。9。2 主要技术指标················································································································ （245 ）
3。9。3 芯片封装及引脚功能···································································································· （245 ）
3。9。4 内部结构及工作原理···································································································· （248 ）
3。9。5 应用电路设计················································································································ （251 ）
3。10 2。4GHz DSSS 收发器芯片组RFW302 原理与应用电路设计················································ （252 ）
3。10。1 概述····························································································································· （252 ）
3。10。2 主要技术指标··················································································
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